The TMT-PH200 uses sensor control feedback loop to control the infrared preheater temperature and is suitable for leaded and lead-free preheating processes.
Sensor control feedback loop to control temperature.
Adjustable, easy to use temperature control knob.
Digital display s..
The TMT-PH300 uses advanced intelligent temperature control technology to control the infrared preheater. Three heating modes allow the unit to handle leaded & lead-free preheating processes and are suitable for use with PCB containing BGA and SMD components.
Microprocessor accurately r..
The TMT-PH600 uses advanced, intelligent, control technology to accurately regulate the temperature of the infrared board preheater. Three heating modes allow the system to manage both leaded and lead free applications.
Microprocessor accurately regulates temperature
Two external temper..
Thermaltronics DS-KIT-1 desoldering kit for use on the TMT-9000S uses shop air to create a powerful air vacuum to clean through-holes quickly and efficiently. Cleaning and maintenance is quick and easy with the use of replaceable filter wools (DS-FW-1) and chamber liners (DS-CL-1).
The TMT-2000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material.
Curie Heat Technology operating at 470KHz.
The TMT-ASTC automatic solder tip cleaner helps rework badly oxidized tips. Two high quality brass brushes, which revolve in opposite directions, aid in the removal of oxidisation from the soldering tip.
Removes tip oxidation
Light & compact, takes up minimal benchtop space
The TMT-HA300 hot air tool uses a large diaphragm pump and can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.
Digital display shows temperature and status.
Airflow meter provides visual feedback of air flow.
Large selection of high q..
The TMT-9000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material.
High thermal recovery & performance.